HANDS ON PCB DESIGN TRAINING

Status: Active
PCB Design training by Domain Leader - Starts on 18.11.2020
By attending the training you will be able to design robust PCB as per industry standards. Unique opportunity to work on current industry standards and technologies using renowned software under the guidance of hands-on experts.

Pre-requisites:

1.  High-speed Internet bandwidth
2.  Any Diploma/Degree holders with basic electronics knowledge are eligible
3.  Students pursuing Electronics/Electrical courses are eligible (Diploma/Degree)
4.  To obtain a certificate, MUST attend all classes

TRAINING SCOPE
- Stages of PCB design
- Efficient use of ECAD Softwares
- Co-relation with IPC design standards
- PCB Design Review workflow process
- Design for Fabrication/Assembly/Test aspects

TRAINING SPECIFICS
Duration of the training is 7 days for 4hrs/day (2hrs theory+2hrs practical). 
More details are provided in the below table. 

Software access will be provided to practice. 

This course has been designed for Electronics hardware & PCB layout engineers. 
More emphasis is given on the design basics and bottlenecks that are to be understood in High-reliability layout Engineering. 
The course is structured with sample projects, practical approach & introduction to IPC standards.

Day 1                     Module 1: Introduction to the PCB designing & overall process
                               PCB design process
                               
Day 2                     Module 2: Libraries
                               Symbol creation and Footprint creation, Mapping Libraries
                                 
Day 3                     Module 3: Multi-layer PCB design
                               Schematic creation, Board Packaging

Day 4                     Module 3: Multi-layer PCB design
                               Mechanical, Stack up, Constraints – Multilayer Board Implementation

Day 5                     Module 3: Multi-layer PCB design
                               Placement – Mixed-signal Design Implementation

Day 6                     Module 3: Multi-layer PCB design
                               Routing – Multilayer Board Implementation

Day 7                     Module 4: Post process
                               Output generation, Gerber file Creation & Deliverables to Industry Standards

Day 8                     Module 5: Evaluation - Written Evaluation will be conducted & Grade certificate will
                               be emailed along with a training completion certificate.

                               Maximum 25 learners per batch 

ADVANCED HANDS-ON PCB DESIGN TRAINING

Status: Active
Advanced PCB Design training by Domain Leader - Starts in December
High-speed technologies carry significant design and manufacturing challenges. By attending the training you will be competitive enough to design highspeed boards considering important parameters, need of today such as Signal Integrity, Power Integrity, EMI/EMC & Thermal.
Unique opportunity to work on current industry standards and technologies using renowned software under the guidance of hands-on experts.

Pre-requisites:

1. High-speed Internet bandwidth
2. Basic Electronics Diploma/Degree completion(Electronics Students are exceptional)
3. To obtain a certificate, MUST attend all classes

TRAINING SCOPE
- HDI design concepts
- Impedance controlled Stackup build with hybrid materials
- Highspeed design guidelines, constraints, placement & routing
- Signal Integrity/Power Integrity-Made simple for layout engineers.

TRAINING SPECIFICS
Duration of the training is 7 days for 4hrs/day (2hrs theory+2hrs practical).
More details are provided in the below table.

Software access will be provided to practice.

This course has been designed for Electronics hardware & PCB layout engineers with basic PCB design knowledge.
More emphasis is given on high-speed design implementation in co-relation with signal integrity & power integrity.
The course is structured with sample projects, SI/PI reports & results, concurrently introducing to design standards & terminologies.

Day 1                    Module 1: HDI Designs concepts
                              HDI design guidelines & implementation

Day 2                    Module 2: Stackup Design & constraint setup
                              Building impedance controlled Stackup using highspeed materials, Hybrid materials

Day 3                    Module 3: Introducing to various Serial & Parallel highspeed interfaces
                              Highspeed design guidelines, constraints set up

Day 4                    Module 3: continued…
                              Placement & routing - Design implementation using HDI technology
                                   
Day 5                    Module 3: continued…
                              Placement & routing - Design implementation using HDI technology
                                   
Day 6                    Module 4: Signal integrity terminologies
                              To understand & co-relate signal integrity terminologies & reports.

Day 7                    Module 5: Introduction to DFX analysis & Documentation

                                 
Day 8                    Module 6: Evaluation - Written Evaluation will be conducted & Grade certificate will
                              be emailed along with a training completion certificate.

                              Maximum 25 learners per batch 

HANDS ON PCB DESIGN TRAINING

Active

Corporate Fee: INR 18000.0

Students can avail 50% Discount

PCB Design training by Domain Leader - Starts on 18.11.2020
By attending the training you will be able to design robust PCB as per industry standards. Unique opportunity to work on current industry standards and technologies using renowned software under the guidance of hands-on experts.

Pre-requisites:

1.  High-speed Internet bandwidth
2.  Any Diploma/Degree holders with basic electronics knowledge are eligible
3.  Students pursuing Electronics/Electrical courses are eligible (Diploma/Degree)
4.  To obtain a certificate, MUST attend all classes

TRAINING SCOPE
- Stages of PCB design
- Efficient use of ECAD Softwares
- Co-relation with IPC design standards
- PCB Design Review workflow process
- Design for Fabrication/Assembly/Test aspects

TRAINING SPECIFICS
Duration of the training is 7 days for 4hrs/day (2hrs theory+2hrs practical). 
More details are provided in the below table. 

Software access will be provided to practice. 

This course has been designed for Electronics hardware & PCB layout engineers. 
More emphasis is given on the design basics and bottlenecks that are to be understood in High-reliability layout Engineering. 
The course is structured with sample projects, practical approach & introduction to IPC standards.

Day 1                     Module 1: Introduction to the PCB designing & overall process
                               PCB design process
                               
Day 2                     Module 2: Libraries
                               Symbol creation and Footprint creation, Mapping Libraries
                                 
Day 3                     Module 3: Multi-layer PCB design
                               Schematic creation, Board Packaging

Day 4                     Module 3: Multi-layer PCB design
                               Mechanical, Stack up, Constraints – Multilayer Board Implementation

Day 5                     Module 3: Multi-layer PCB design
                               Placement – Mixed-signal Design Implementation

Day 6                     Module 3: Multi-layer PCB design
                               Routing – Multilayer Board Implementation

Day 7                     Module 4: Post process
                               Output generation, Gerber file Creation & Deliverables to Industry Standards

Day 8                     Module 5: Evaluation - Written Evaluation will be conducted & Grade certificate will
                               be emailed along with a training completion certificate.

                               Maximum 25 learners per batch 

ADVANCED HANDS-ON PCB DESIGN TRAINING

Active

Corporate Fee: INR 25000.0

Students can avail 50% Discount

Advanced PCB Design training by Domain Leader - Starts in December
High-speed technologies carry significant design and manufacturing challenges. By attending the training you will be competitive enough to design highspeed boards considering important parameters, need of today such as Signal Integrity, Power Integrity, EMI/EMC & Thermal.
Unique opportunity to work on current industry standards and technologies using renowned software under the guidance of hands-on experts.

Pre-requisites:

1. High-speed Internet bandwidth
2. Basic Electronics Diploma/Degree completion(Electronics Students are exceptional)
3. To obtain a certificate, MUST attend all classes

TRAINING SCOPE
- HDI design concepts
- Impedance controlled Stackup build with hybrid materials
- Highspeed design guidelines, constraints, placement & routing
- Signal Integrity/Power Integrity-Made simple for layout engineers.

TRAINING SPECIFICS
Duration of the training is 7 days for 4hrs/day (2hrs theory+2hrs practical).
More details are provided in the below table.

Software access will be provided to practice.

This course has been designed for Electronics hardware & PCB layout engineers with basic PCB design knowledge.
More emphasis is given on high-speed design implementation in co-relation with signal integrity & power integrity.
The course is structured with sample projects, SI/PI reports & results, concurrently introducing to design standards & terminologies.

Day 1                    Module 1: HDI Designs concepts
                              HDI design guidelines & implementation

Day 2                    Module 2: Stackup Design & constraint setup
                              Building impedance controlled Stackup using highspeed materials, Hybrid materials

Day 3                    Module 3: Introducing to various Serial & Parallel highspeed interfaces
                              Highspeed design guidelines, constraints set up

Day 4                    Module 3: continued…
                              Placement & routing - Design implementation using HDI technology
                                   
Day 5                    Module 3: continued…
                              Placement & routing - Design implementation using HDI technology
                                   
Day 6                    Module 4: Signal integrity terminologies
                              To understand & co-relate signal integrity terminologies & reports.

Day 7                    Module 5: Introduction to DFX analysis & Documentation

                                 
Day 8                    Module 6: Evaluation - Written Evaluation will be conducted & Grade certificate will
                              be emailed along with a training completion certificate.

                              Maximum 25 learners per batch 

ln